Intel this week is preparing to unveil its upcoming Intel 4 process technology, which is the 7nm standard for semiconductor processes.
This will be the first Intel process node leveraging EUV lithography and is said to produce over 20% performance gains at the same power consumption as Intel 7 now. Chips based on Intel 4 will be of 14-gen Meteor Lake, scheduled for production in Q2 next year.
New Intel 4 Process Node
At this year’s IEEE Symposium on VLSI Technology & Circuits event, Intel is gearing up to launch its long-awaited EUV-based process node – Intel 4 technology that can outperform the competition. From the leaked papers that Intel is going to talk on, we’ve come to know that its upcoming process node – Intel 4 – double the achievable transistor density relative to Intel 7.
Intel 4 -1.8-2.0x HP scaling -40-50% less power, +12% peak perf ( @davidbepo ) -4:3 fin depopulation -2nd gen contact over gate -2nd gen single dummy gate -eCu = Ta/Co barrier + pure Cu -2x MIM cap scaling (10x vs 14nm) -18 layers (+1) -EUV: -20% masks, -5% total steps (vs. 7) pic.twitter.com/325HwQEKug — witeken (@witeken) June 11, 2022
